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Honda and Renesas Electronics Corporation have announced a partnership to develop a high-performance system-on-chip (SoC) designed for software-defined vehicles (SDVs). This new SoC will deliver industry-leading AI performance and power efficiency, targeting use in the upcoming Honda 0 Series electric vehicles, which are slated for launch in the late 2020s. The announcement was made during Honda’s press conference at CES 2025 in Las Vegas, Nevada.
Key Highlights
- Performance and Efficiency: The SoC offers 2,000 TOPS AI performance and 20 TOPS/W power efficiency, ensuring advanced capabilities with minimal energy consumption.
- Centralized Architecture: The Honda 0 Series will adopt a centralized electronic control unit (ECU) system, combining multiple ECUs into one for managing ADAS, powertrain control, and comfort features.
- Advanced Semiconductor Technology: The SoC will utilize TSMC’s 3-nm automotive process technology, enabling significant power consumption reductions.
- Custom AI Accelerators: Renesas integrates its R-Car X5 SoC series with an AI accelerator tailored to Honda’s independently developed AI software, enhancing flexibility and future scalability.
- Chiplet Technology: Multi-die chiplet technology will allow customization and performance upgrades to meet evolving demands for advanced vehicle functions.
Honda’s focus on SDVs aims to deliver a personalized mobility experience for customers, powered by cutting-edge AI and software innovations. The centralized ECU in the Honda 0 Series will manage a wide range of critical functions, requiring the new SoC to provide higher processing performance while maintaining energy efficiency.
Renesas, known for its automotive semiconductor solutions, will leverage its multi-die chiplet technology to combine its fifth-generation R-Car X5 SoC with Honda’s proprietary AI accelerators. This collaboration ensures the SoC meets the stringent demands for advanced functions like Automated Driving (AD) and Advanced Driver Assistance Systems (ADAS) while maintaining low power consumption.
The use of TSMC’s 3-nm process technology will further enhance the SoC’s efficiency. According to Honda, this chip will serve as the heart of the SDV’s centralized ECU, marking a significant leap in vehicle design and functionality.
With years of collaboration, Honda and Renesas aim to accelerate the integration of advanced semiconductor and software technologies in the Honda 0 Series, enhancing customer mobility experiences and setting a benchmark for the future of SDVs.
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